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Microelectronics Packaging Handbook, Part I: Technology Drivers Pt. 1



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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few ... Read more
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Features
Author Rao R. Tummala , Alan G. Klopfenstein , E.J. Rymaszewski
Brand Unbranded
Format Hardcover
ISBN 9780412084317
Publication Date 02/03/2005
Publisher Kluwer Academic Publishers
Manufacturer Kluwer Academic Publishers Group
Description

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.

Volume 1: Technology Drivers covers the driving force of microelectronics packaging--electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.


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Microelectronics Packaging Handbook - Technology Drivers Part I (Hardcover 2nd Ed. 1997)
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