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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS The Springer International Series in Engineering and Computer Science



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Describes the method of fatigue life prediction of solder joints in electronic packages in detail starting from the theoretical basis. This title provides reader with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic ... Read more
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Features
Author Erdogan Madenci , Ibrahim Guven , Istvan Maros
Format Hardcover
ISBN 9781402073304
Publication Date 10/01/2010
Publisher Springer
Manufacturer Kluwer Academic Publishers
Description

Describes the method of fatigue life prediction of solder joints in electronic packages in detail starting from the theoretical basis. This title provides reader with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. It also discusses the steps of the analysis method.


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