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699 products for "interconnect"
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3D Interconnect Architectures For Heterogeneous Technologies - Modeling And Optimization (Hardcover 1st Ed. 2022)
Interconnect Technologies For Integrated Circuits And Flexible Electronics (1st Ed. 2024)
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Interconnect Technologies For Integrated Circuits And Flexible Electronics 1ST Ed. 2024
Nano Interconnects - Device Physics Modeling And Simulation (Hardcover)
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Nano Interconnects - Device Physics Modeling And Simulation Hardcover
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Electromigration In Metals - Fundamentals To Nano-Interconnects (Hardcover)
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Electromigration In Metals - Fundamentals To Nano-interconnects Hardcover
In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node
Photonic Interconnects For Computing Systems - Understanding And Pushing Design Challenges Hardcover
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Photonic Interconnects For Computing Systems - Understanding And Pushing Design Challenges Hardcover
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging,
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Reliability Of Rohs-compliant 2D And 3D Ic Interconnects Hardcover Ed
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new
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Materials Technology And Reliability For Advanced Interconnects And Low-k Dielectrics: Volume 612 Paperback
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new
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Materials Technology And Reliability For Advanced Interconnects And Low-k Dielectrics - 2004 Paperback
Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with
Self-Organized 3D Integrated Optical Interconnects - With All-Photolithographic Heterogeneous Integration (Hardcover)