Materials Technology And Reliability For Advanced Interconnects And Low-k Dielectrics

This book is about materials technology and reliability for advanced interconnects and low-k dielectrics in the microelectronics industry. The book highlights important achievements and challenges in this field, and it includes reviews of significant progress that has been made as well as challenges that remain. Contributors from different countries present papers on current topics using a truly multidisciplinary approach.

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.