Description
1. Android 8.0 operating system.
2. MT6797 (Helio X27) Deca Core up to 2.6GHz(A72*2 2.6GHz, A53*4 1.9GHz, A53*4 1.4GHz).
3. 4GB DDR3 RAM and 64GB EMMC 5.1 ROM storage.
4. 10.8 inch IPS 2560 x 1600 pixel screen resolution.
5. Support an external Micro SD card, up to 128GB (not included).
6. Built-in 7000mAh lithium-polymer battery.
7. 8.0MP front camera + 8.0MP rear camera.
8. Support dual band WiFi, Bluetooth, GPS, FM etc.
Specification:
General
Screen Size
10.8 inch
Model
Hi9 Plus
SIM Quantity
Dual SIM
SIM Types
Nano SIM Card
Material
Metal, Plastic
Processor Manufacture
MTK
CPU
MT6797 (Helio X27) Deca Core up to 2.6GHz
OS
Android 8.0
GPU
T880 up to 780MHz
RAM
4GB
ROM
64GB
External Memory
TF card up to 128GB (not included)
Screen Types
IPS Capacitive Screen
Display Resolution
2560 x 1600
Supporting Languages
English, Simple Chinese, Traditional Chinese
Network
Network Types
FDD-LTE, WCDMA, GSM, TDD-LTE
Frequency
Band (2G): GSM 850/900/1800/1900MHz
Band (3G): WCDMA 850/900/1900/2100MHz
Band (4G): FDD-LTE 800/850/900/1800/1900/2100/2600MHz
TDD-LTE 2300MHz
WiFi
802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, Support, 2.4GHz/5GHz
Bluetooth
V4.1, Support
GPS
Support
Camera
Camera Types
Dual
Rear Camera
8.0MP
Front Camera
8.0MP
Battery
Types
Non-detachable Li-Polymer
Capacity
7000mAh, 3.8V
Power
5V/2A
Dimensions
Size
266.6*177*8.1mm